Advanced manufacture focusing on new and emerging technologies : selected peer reviewed papers from the 2007 International Conference on Advanced Manufacture, Tainan, Taiwan, R.O.C., November 26-November 28, 2007 /
Booming economic development in Asia, particularly of the leading manufacturing industries which produce flat-panel displays, communication-devics, computers and other products in the micro/nano field has stimulated an intense research effort in universities, development-oriented institutions and in...
| Автор-организация: | International Conference on Advanced Manufacture Tai-nan shih, Taiwan), Society of Manufacturing Engineers., Guo li Chenggong da xue. |
|---|---|
| Други автори: | Hwang, Sheng-Jye., Lee, Sen Yung. |
| Формат: | Електронен |
| Език: | English |
| Публикувано: |
Stafa-Zurich, Switzerland ; Enfield, NH :
Trans Tech Publications,
℗♭2008.
|
| Серия: |
Materials science forum ;
v. 594. |
| Предмети: | |
| Онлайн достъп: |
http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=512863 |
| Подобни документи: |
Print version::
Advanced manufacture. |
Съдържание:
- Advanced Manufacture; Committees; Preface; Table of Contents; Mechanism Design of ITO-Layer Removal from Color Filter of TFT-LCD; Design and Fabrication of a General Purpose 3D Digitizer Based on Grinding Technique; Prototyping of Image-Based Inspection Mechanisms by CAD and Virtual Reality Technology; Simulation of Dendritic Growth in Solidification of Al-Cu Alloy by Applying the Modified Cellular Automaton Model with the Growth Calculation of Nucleus within a Cell; Study on Dendrite Shapes of Solidification in an Undercooled Melt.
- Simulation of Cooling Process of Medium Thickness Steel PlateDeformation Characteristics on Surface Layer of White-Coated Paperboard by Center Bevel Blade Subjected to Pushing Load; A Forging Simulation by Using the Point Collocation Method with a Boundary Layer of Finite Element; Bending Die Design for a Pre-Formed Sheet Metal with a Golden Finger Feature; An Optimization Approach to the Displacement Volumes for External Spur Gear Pumps; Evaluation of UHMWPE Component under Various Positions for UKA; Development of a Constant Temperature Environment Chamber with High Stability.
- Researches of a Novel 2D CMOS Thermal Based AccelerometerA Finite Element Investigation into the Changing Channel Angular Extrusion of Brass Alloy; Fabrication and Analysis of Nano-Aluminum-Induced Low-Temperature Polycrystalline Silicon Film; Research on Piezoelectric Actuator Driving Method of Creep Resistance; The Design and Building of a Robot with Five Degrees of Freedom; The Design and Evaluation of a Supply Chain Logistic Hub for Automobile and Parts Distribution; Fabrication Micro-Nozzle Plates for Inkjet Print Head Using LIGA Process.
- Effects of Substrate Geometry on Performance of Twin-Fluid Atomizer in Metal Powder ProductionSynthesis of Core/Shell Type of Hybrid Magnetic Particle by Using Polyionic Copolymer with Extra Magnetic Field; Experimental Studies of Meniscus Dynamic Behaviors in a Squeeze-Mode Piezoelectric Inkjet Printhead; Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements; Finite Element Prediction of Stack-Die Packages under Board Level Drop Test; Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading.
- Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale AbrasivesAnalysis of Conventional Spinning Process with Thermal Effects; A Study of Cutting Temperatures in Turning of Glass Fiber Reinforced Plastics Materials; Automation Finish Processes of Sword Surface Using Burnishing Assistance; The Study of Effects of Cutting Parameters and PVD-Coatings on Tool Life of Micro End Drill by Using Taguchi Method; Experimental Study on Five-Axis Machining Parameter for NAK80 Die Steel; Fast Nanometer Positioning of Heavy Loads Using a Hybrid Driver.