Rapid thermal processing for future semiconductor devices : proceedings of the 2001 International Conference on Rapid Thermal Processing for Future Semiconductor Devices (RTP 2001), held at Ise-Shima, Mie, Japan, November 14-16, 2001 /
This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokk...
| Автор-организации: | International Conference on Rapid Thermal Processing for Future Semiconductor Devices Ise-Shima, Mie, Japan) |
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| Други автори: | Fukuda, Hisashi. |
| Формат: | Електронна книга |
| Език: | English |
| Публикувано: |
Amsterdam ; London :
Elsevier,
2003.
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| Предмети: | |
| Онлайн достъп: |
http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=203153 |
| Подобни документи: |
Print version::
Rapid thermal processing for future semiconductor devices. |
| Резюме: |
This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices. This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies. |
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| Физически характеристики: |
1 online resource (x, 150 pages) : illustrations |
| Библиография: |
Includes bibliographical references. |
| ISBN: |
9780444513397 0444513396 9780080540269 0080540260 |