Rapid thermal processing and beyond applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany /
Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to red...
| Други автори: | Lerch, W., Niess, J. |
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| Формат: | Електронен |
| Език: | English |
| Публикувано: |
Stafa-Zurich, Switzerland ; United Kingdom ; Enfield, NH :
Trans-Tech Publications,
℗♭2008.
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| Серия: |
Materials science forum ;
v. 573-574. |
| Предмети: | |
| Онлайн достъп: |
http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=512841 |
| Подобни документи: |
Print version::
Rapid thermal processing and beyond. |
| Онлайн достъп от Библиотека ”Паница” на Американския университет в България: |
http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=512841 |
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| Провери в Paniza Library, AUBG | Сигнатура: |
QC611.6.T4 R37 2008eb |
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